CAPABILITIES

PCB Assembly & Testing

We specialize in low to medium volume production & high mix assemblies.

Gen Pack Assembly Services Inc is your full solution for your Electronic Manufacturing needs. With a broad set of technologies and additional value-added services, together we work with one single goal of bringing your products to market efficiently.

Our Technologies & Capabilities

  • Solder Paste Printing & 2D SPI (solder paste inspection)
  • Surface Mount Capabilities (Fine Pitch, 01005 Chip, BGA, Odd Form)
  • Through-hole Automated Selective Solder/DIP insertion/Manual Hand Soldering
  • 2D Automatic Optical Inspection (IPC Class 2/Class 3)
  • Single/Double Sided Capabilities
  • Programming & Testing (Functional Testing/In-Circuit Testing)
  • High mix and low-medium volume complex printed circuit board assembly & sub-assembly

Why Choose Gen Pack

25+ Years Experience

Gen Pack has continued to meet customer requirements and exceed expectations, at a competitive cost.

Newest Technology

Continued investment in the newest technology & facilities brings greater advantage in providing the most advanced capabilities to our customers.

Quality Guarantee

Gen Pack Assembly Services Inc. operates under ISO 9001:2015 standards, maintaining IPC Class 2 & Class 3 quality certifications.