CAPABILITIES

PCB Assembly & Testing

We specialize in low to medium volume production & high mix assemblies.

Gen Pack Assembly Services Inc is your full solution for your Electronic Manufacturing needs. With a broad set of technologies and additional value-added services, together we work with one single goal of bringing your products to market efficiently.

Our Technologies & Capabilities

  • Solder Paste Printing & 2D SPI (solder paste inspection)
  • Surface Mount Capabilities (Fine Pitch, 01005 Chip, BGA, Odd Form)
  • Through-hole Automated Selective Solder/DIP insertion/Manual Hand Soldering
  • 2D Automatic Optical Inspection (IPC Class 2/Class 3)
  • Single/Double Sided Capabilities
  • Programming & Testing (Functional Testing/In-Circuit Testing)
  • High mix and low-medium volume complex printed circuit board assembly & sub-assembly
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Industries We Serve

Why Choose Gen Pack

25+ Years Experience

Gen Pack has continued to meet customer requirements and exceed expectations, at a competitive cost.

Newest Technology

Continued investment in the newest technology & facilities brings greater advantage in providing the most advanced capabilities to our customers.

Quality Guarantee

Gen Pack Assembly Services Inc. is proudly ISO 9001:2015 certified, maintaining IPC-A-610H and IPC-J-STD-001H Standards.

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675 Arvin Avenue
Stoney Creek, ON
L8E 5R2
CANADA

Mon – Fri: 6 AM – 4:30 PM
(905) 643-0082

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CAPABILITIES

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